Tempest is a non-contact, bulk reagent dispenser that utilizes 96 individually-controlled nozzles to dispense any volume of up to 12 different reagents into any well.

一 key features

Modular - the modular dispense head can accept up to 12 easily replaceable chips, each with 8 dispense nozzles

Efficient - non-recoverable dead volume of<40 μL, and a dead volume of 100 μL using pipette tip dispensing

Fast - dispense 200nL to 96-well plate in just 3 seconds and 1uL to 384-well plate in just 5 seconds.

Flexible - Tempest supports most SBS plate types and has optional barcode reader and plate stacking capabilities

Reliable - non-contact micropump technology dispenses using positive displacement to maintain accuracy and precision across millions of dispense cycles
 

二 state-of-the-art dispensing technology

 At the core of the Tempest is a microfluidic valve cluster that can meter and dispense discrete volumes of liquid using positive displacement. This valve cluster has two micro-diaphragms (select either 200 nL and 1 μL, or 1 μL and 5 μL) that can fill and dispense as fast as 8 times per second. This technology is incredibly precise and viscosity independent.

conserve reagents

 Tempest is capable of returning any excess sample from the microfluidic chip back into the ingredient reservoir to conserve reagents. The Tempest can recirculate reagents to keep cells and beads in suspension within the source container to ensure consistency throughout the process.
 

三 easy-to-use software

 The Tempest software provides a straightforward, user-friendly way to design and execute even the most complex dispensing protocols. The control software offers an intuitive visual layout of both the plate design and the hardware setup, and provides tools to create gradient designs and backfills. Microsoft Excel integration allows you to manually edit well volumes for additional control.
 

四 customizable to meet your needs

 As the Tempest can accept up to 12 microfluidic chips at once, each machine can be configured with any

combination of high volume (1 μL and 5 μL) and low volume chips (200 nL and 1 μL) to fit your application and budget.